Conductive Shielding and Thermal Gap Pads
EMI/RFI SHIELDING GASKETS
Electromagnetic interference (EMI) can disrupt the operations or affect the performance of electronic systems, equipment, and individual devices. For ones used in critical applications, such as in the aerospace, medical, military, navigation, or transit sectors, these disruptions or alterations can have catastrophic effects.
EMI/RFI shielding gaskets serve as a preventative measure, protecting sensitive electronics from both electromagnetic and RFI (radio-frequency interference). These hybrid mechanical-electrical devices are made of various conductive elastomers and filled silicones suitable for use in a variety of operating environments and temperature extremes. Depending on the project specifications and application, the gaskets can be designed using a pressure-sensitive adhesive (PSA), mechanical fastening, or grooved press-fitting methods.
Thermal Gap Pads
Die Cut Technologies manufactures thermal gap filler pads for managing heat within electronic assemblies. These gap fillers are used to bridge the interface between hot components and a chassis or heat sink assembly to increase the overall heat transfer from the system. The unique combination of thermal conductivity and softness reduces mechanical stress while maintaining thermal performance. We are authorized distributors of extensive gap filler product lines that cover a wide range of performance capabilities, including ultra-thin gap fillers, a high deflection, and materials that provide electrical isolation.
Thermal gap filler pads are made from silicone polymer that is combined with a thermal medium (usually ceramic). The silicone and ceramic powders are mixed, cast, and cured to a soft, conformal thermal pad in sheet form. Gap filler pads are inherently tacky which also aids in the assembly process. Thermal pads are also more stable than phase change products and have higher operating temperatures. Thermal gap filler pads range in thickness from .020″ to .250″. Thermal performance ranges from 1.0 Watt/meter-Kelvin (W/m-K) to 5.0 W/m-K. Gap pads are cut into individual pads using our digital cutting process or die-cut for larger quantities.
Electronic Parts Die Cutting
Die Cut Technologies offers precision die cutting for these sensitive electronic assemblies requiring EMI/RFI shielding, conductive elastomers, and thermal gap pads. DCT will combine the right shielding material and production method to help our OEM customers meet their specific electronic applications.
Whether it is a complex medical device or a simple gap pad. Our experts will provide a value-added solution by combining the best value material with the most efficient converting process. When it comes to custom electronic parts, high-quality materials at a competitive price is what customers require.
DCT has developed long term strategic relationships with the premier world-class providers of EMI/RFI Shielding materials, conductive elastomers, and thermal silicones. Companies such as Bergquist, Laird, Parker-Chomerics, and 3M are among our key suppliers.
DCT’s in-house capabilities include digital and laser cutting, providing prototypes or production quantities of shielding gaskets and thermal gap pads. Engineering is capable of creating intricate designs in a matter of seconds. We have kiss cutting capabilities for adhesive-backed conductive elastomers in addition to a Class 100,000 cleanroom to keep your electronic parts free of dust and dirt. For a totally integrated solution, we also offer custom packaging to ensure they reach you exactly how you want them. We offer all of this and more at competitive pricing to stay ahead of our competition, and we have a long track record of delivering quality products on-time, every time.
We provide custom die-cut parts for manufacturers across the globe. When it comes to EMI/RFI shielding gaskets and Thermal Gap pads, let DCT be your one-stop-shop from rapid prototyping to custom packaging. Let’s get started today – contact us for a free quote!