Die Cut Technologies, a leading manufacturer of sealing solutions has recently added Form-In-Place capabilities suited for OEM's in electronics, cast, machined or plastic enclosures and assemblies.

Form-In-Place is an automated system for dispensing conductive elastomer shielding, grounding, environmental gaskets and adhesives onto metal or plastic substrates. Gaskets can be dispensed onto any conductive painted, plated or metallic surface of an electronic enclosure to protect it internally from radiated interference and environmental elements.

Die Cut Technologies Form-In-Place is designed to meet the increasing demand for cost effective solutions that combine environmental, EMI, grounding, galvanic performance and adhesives in one product.

The low cost process consists of a fully programmable 3-axis robot that allows a bead of silicone, urethane or adhesive to be precisely dispensed onto small areas or into grooves directly onto the customers hardware. The system and compounds are suitable for applications on metal or plastic. Low tooling and programming costs allow the use of this technology in both prototypes and production volumes. It is ideally suited for small diameter sections where handling of traditional gaskets is difficult and expensive.

Features & Benefits:

• Total cost savings in materials, labor and assemblies
• Room temperature cure eliminates the need for costly heat curing systems and the use of low cost plastic or metal substrates
• Gaskets as small as 0.4mm allow for critical space
• Excellent adhesion and EMI shielding effectiveness